Interconnect Technologies adds "System-in-package"
to its growing portfolio of packaging devices
Interconnect Technologies names George A. Shaw and Wayne F.
Moore to its executive management team
Interconnect Technologies adds fine pitch quad flat packages
to its growing line-up of advanced packaging solutions
Interconnect Technologies' Austin, Texas testing facility is
awarded ISO 9002 certification
supports a broad range of communications applications with growing
line-up of ultra-compact radio frequency components
Twain comes to Orange County in "Concerts for Fifth Graders"
strengthens commitment to the consumer audio market with the
introduction of TOSLINK® optical modules
Packaging - "Manufacturing-less" IC companies
Packaging - “Packaging matured as volumes grew”
News - Flipping Over Flip-Chip
- Executive Comment: Open communications key to effective global
Times - Battery power trade-offs: lower voltage or higher capacity?
Times - Can low temp poly-silicon meet the large display challenge?
Interconnect Technologies - Spring 2002
Interconnect Technologies - Summer 2002